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2017.07.25

A paper by WPI Assoc. Prof. Chieko Kondou and Prof. Shigeru Koyama (NEXT-RP) published in "Applied Thermal Engineering"

A paper by WPI Assoc. Prof. Chieko Kondou and Prof. Shigeru Koyama (Research Center for Next Generation Refrigerant Properties (NEXT-RP) has been published in the scientific journal "Applied Thermal Engineering."

 

■ Paper

Title: Improving the heat dissipation performance of a looped thermosyphon using low-GWP volatile fluids R1234ze(Z) and R1234ze(E) with a superhydrophilic boiling surface

Authors: Chieko Kondou, Shohei Umemoto, Shigeru Koyama, and Yutaka Mitooka

DOI: 10.1016/j.applthermaleng.2017.02.073


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